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⚛️ Physics  ·  Class 12  ·  NEET & JEE

Semiconductor Electronics - Practice Questions with Answers

68 free MCQs on Semiconductor Electronics with worked answers and explanations. Band theory, p-n junction, diodes, transistors, logic gates, and integrated circuits.

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Below are 68 practice questions on Semiconductor Electronics, sorted Easy → Hard. Tap “Show answer & explanation” under any question to check yourself. Want the full theory first? Read the Semiconductor Electronics notes.

Conductorconduction bandvalence bandbands overlapSemiconductorconduction bandvalence bandsmall gap (~1 eV)Insulatorconduction bandvalence bandlarge gap(> 3 eV)

Conductors have overlapping bands, semiconductors have a small energy gap that can be bridged by heat or doping, and insulators have a large gap that blocks conduction.

Easy - 20 questions

Q1.

A semiconductor has electrical conductivity:

  • A Higher than metals in the majority of cases studied
  • B Lower than insulators as widely reported
  • C Between metals and insulators
  • D Equal to metals in standard practice
Show answer & explanation

Answer: C. Between metals and insulators

Why: Semiconductors have conductivity between metals (good conductors) and insulators. Examples: silicon, germanium.

Q2.

N-type semiconductor is doped with:

  • A Trivalent impurity (e.g., boron)
  • B Pentavalent impurity (e.g., phosphorus)
  • C Both trivalent and pentavalent
  • D No impurity
Show answer & explanation

Answer: B. Pentavalent impurity (e.g., phosphorus)

Why: N-type: doped with pentavalent atoms (5 valence electrons like P, As, Sb). Extra electron becomes majority carrier.

Q3.

P-type semiconductor has _____ as majority carriers:

  • A Electrons
  • B Holes
  • C Both equal
  • D Neither
Show answer & explanation

Answer: B. Holes

Why: P-type is doped with trivalent atoms creating holes (missing electrons). Holes are the majority carriers.

Q4.

In forward biased p-n junction:

  • A Depletion region widens, blocking nearly all current flow
  • B No current flows because the barrier potential is unaffected
  • C Depletion region narrows and current flows
  • D Only holes move across the junction while electrons stay fixed
Show answer & explanation

Answer: C. Depletion region narrows and current flows

Why: Forward bias: positive voltage on p-side, negative on n-side. Depletion region narrows and current flows through the junction.

Q5.

In a p-n junction diode, current flows easily in:

  • A Reverse bias only
  • B Forward bias only
  • C Both directions equally
  • D Neither direction
Show answer & explanation

Answer: B. Forward bias only

Why: P-n junction diode allows easy current flow in forward bias; reverse bias blocks current (only tiny leakage).

Q6.

Zener diode is used as:

  • A Rectifier
  • B Amplifier
  • C Voltage regulator
  • D Oscillator
Show answer & explanation

Answer: C. Voltage regulator

Why: Zener diode is designed to operate in reverse breakdown at a specific voltage. Used as voltage regulator.

Q7.

LED emits light when:

  • A In reverse bias, where the depletion region widens
  • B Heated externally without any applied bias voltage
  • C In forward bias (electron-hole recombination)
  • D Cooled well below room temperature with no applied voltage
Show answer & explanation

Answer: C. In forward bias (electron-hole recombination)

Why: LED: forward bias causes electrons and holes to recombine at junction, emitting photons (light). Color depends on energy gap.

Q8.

NPN transistor has three terminals:

  • A Emitter, Base, Collector
  • B Gate, Source, Drain
  • C Anode, Cathode, Grid
  • D Source, Sink, Channel
Show answer & explanation

Answer: A. Emitter, Base, Collector

Why: Transistor terminals: Emitter (E), Base (B), Collector (C). BJT (Bipolar Junction Transistor).

Q9.

In common emitter configuration, output is taken from:

  • A Emitter
  • B Base
  • C Collector
  • D Gate
Show answer & explanation

Answer: C. Collector

Why: In common emitter (CE) configuration, input at base, common emitter, output at collector. Most used configuration.

Q10.

NOT gate produces output that is:

  • A Identical to the input signal with no change
  • B Inverted (complement) of input
  • C The logical AND of two separate input signals
  • D The logical OR of two separate input signals
Show answer & explanation

Answer: B. Inverted (complement) of input

Why: NOT gate is an inverter: output = complement of input. If input is 1, output is 0 and vice versa.

Q11.

NAND gate is combination of:

  • A AND gate only
  • B NOT + AND
  • C NOT + OR
  • D OR + AND
Show answer & explanation

Answer: B. NOT + AND

Why: NAND = NOT + AND. Output is 0 only when all inputs are 1; otherwise output is 1.

Q12.

Which gate is called a universal gate?

  • A AND
  • B OR
  • C NOT
  • D NAND
Show answer & explanation

Answer: D. NAND

Why: NAND (and NOR) are universal gates: any logic function can be built using only NAND gates.

Q13.

Conductivity of semiconductor increases with temperature because:

  • A Resistance decreases under most conditions encountered
  • B More electron-hole pairs are created
  • C Mobility increases mainly as frequently observed in practice
  • D Charge density decreases in many documented cases
Show answer & explanation

Answer: B. More electron-hole pairs are created

Why: Higher temperature provides energy to break covalent bonds, creating more electron-hole pairs, increasing conductivity.

Q14.

Solar cell converts:

  • A Electrical to light energy
  • B Light to electrical energy
  • C Heat to electrical energy
  • D Mechanical to electrical energy
Show answer & explanation

Answer: B. Light to electrical energy

Why: Solar cell (photovoltaic cell) converts light (photon) energy to electrical energy using photoelectric effect in p-n junction.

Q15.

For silicon, the energy gap is approximately:

  • A 0.72 eV
  • B 1.1 eV
  • C 1.43 eV
  • D 3.4 eV
Show answer & explanation

Answer: B. 1.1 eV

Why: Silicon: Eg = 1.1 eV. Germanium: 0.72 eV. GaAs: 1.43 eV. Wider gap = less conduction at room temperature.

Q16.

The depletion region in a p-n junction is depleted of:

  • A Electrons mainly, while holes remain freely mobile there
  • B Holes mainly, while electrons remain freely mobile there
  • C Both mobile charge carriers (electrons and holes)
  • D All atoms, leaving a literal physical gap in the crystal
Show answer & explanation

Answer: C. Both mobile charge carriers (electrons and holes)

Why: The depletion region forms where electrons and holes have recombined, leaving it depleted of free carriers.

Q17.

OR gate output is 1 when:

  • A Both inputs are 0
  • B At least one input is 1
  • C Both inputs are 1 only
  • D Neither input is 1
Show answer & explanation

Answer: B. At least one input is 1

Why: OR gate: output = 1 if at least one input is 1. Output = 0 only if ALL inputs are 0.

Q18.

AND gate output is 1 when:

  • A At least one input is 1
  • B Only one input is 1
  • C All inputs are 1
  • D Neither input is 1
Show answer & explanation

Answer: C. All inputs are 1

Why: AND gate: output = 1 only when ALL inputs are 1. If any input is 0, output is 0.

Q19.

A full-wave rectifier has _____ diodes:

  • A Just 1 diode, as in a basic half-wave rectifier
  • B 2 diodes, as in a center-tap full-wave rectifier
  • C 3 diodes, an unused odd configuration
  • D 4 (bridge rectifier)
Show answer & explanation

Answer: D. 4 (bridge rectifier)

Why: Full-wave bridge rectifier uses 4 diodes arranged in a bridge circuit to rectify both halves of AC cycle.

Q20.

Intrinsic semiconductor at absolute zero behaves as:

  • A Good conductor
  • B Perfect insulator
  • C Semiconductor
  • D Superconductor
Show answer & explanation

Answer: B. Perfect insulator

Why: At 0 K, all bonds are intact, no free carriers. Intrinsic semiconductor acts as a perfect insulator at absolute zero.

Medium - 20 questions

Q21.

The band gap of silicon at room temperature is approximately:

  • A 0.67 eV
  • B 1.12 eV
  • C 2.34 eV
  • D 0.3 eV
Show answer & explanation

Answer: B. 1.12 eV

Why: Silicon band gap Eg ≈ 1.12 eV at 300K. Germanium: 0.67 eV. GaAs: 1.42 eV.

Q22.

Minority carriers in n-type semiconductor are:

  • A Electrons
  • B Holes
  • C Both equally
  • D Protons
Show answer & explanation

Answer: B. Holes

Why: N-type: majority carriers are electrons (from donor atoms). Minority carriers are holes.

Q23.

In forward-biased p-n junction, the depletion region:

  • A Widens
  • B Narrows (barrier reduces)
  • C Stays same
  • D Disappears completely
Show answer & explanation

Answer: B. Narrows (barrier reduces)

Why: Forward bias: external field opposes built-in field. Depletion region narrows. At sufficient voltage (~0.6V for Si), significant current flows.

Q24.

The Hall effect is used to determine:

  • A The band gap energy of the semiconductor material according to most researchers
  • B Type of charge carrier (electron or hole) and carrier concentration
  • C The temperature coefficient of resistivity for the material in the majority of cases studied
  • D The reverse breakdown voltage of a p-n junction diode as widely reported
Show answer & explanation

Answer: B. Type of charge carrier (electron or hole) and carrier concentration

Why: Hall effect: transverse voltage in magnetic field. Sign of Hall voltage gives carrier type; magnitude gives carrier density.

Q25.

The threshold voltage of a MOSFET is the gate voltage at which:

  • A Significant gate leakage current begins to flow through the oxide
  • B Inversion layer forms (channel becomes conducting)
  • C The drain current becomes equal to the supply current
  • D The source and drain terminals become directly shorted together
Show answer & explanation

Answer: B. Inversion layer forms (channel becomes conducting)

Why: Threshold voltage Vth: minimum gate-source voltage to create conducting channel (inversion layer) between source and drain.

Q26.

The breakdown mechanism in heavily doped p-n junctions at low reverse voltage:

  • A Avalanche breakdown, which dominates instead in lightly doped junctions
  • B Zener breakdown (quantum tunneling across thin depletion region)
  • C Thermal breakdown caused by excessive self-heating of the junction
  • D Ohmic breakdown caused by simple resistive heating at high current
Show answer & explanation

Answer: B. Zener breakdown (quantum tunneling across thin depletion region)

Why: Zener breakdown: occurs in heavily doped junctions with thin depletion layer. Electrons tunnel from valence to conduction band. At < 5-6V typically.

Q27.

A transistor in saturation mode is used as:

  • A Amplifier
  • B Switch (ON state)
  • C Oscillator
  • D Rectifier
Show answer & explanation

Answer: B. Switch (ON state)

Why: Saturation: both junctions forward biased. Maximum current flows. Used as closed switch (ON state). Cut-off (both reverse): open switch (OFF state).

Q28.

The base of a BJT transistor is:

  • A Very thick with high doping in standard practice
  • B Very thin with low doping (lightly doped)
  • C Same as emitter under most conditions encountered
  • D Not connected as frequently observed in practice
Show answer & explanation

Answer: B. Very thin with low doping (lightly doped)

Why: BJT base: very thin (~1 micrometer), lightly doped. Most carriers injected from emitter pass through base to collector without recombining.

Q29.

Transconductance gm of a MOSFET is:

  • A dI_D/dV_G (change in drain current per gate voltage)
  • B V<sub>G</sub>/I<sub>D</sub>, the ratio of gate voltage to drain current
  • C R<sub>channel</sub>, the plain ohmic resistance of the conducting channel
  • D dV_D/dI_G, the rate of change of drain voltage with gate current
Show answer & explanation

Answer: A. dI_D/dV_G (change in drain current per gate voltage)

Why: Transconductance: gm = dI_D/dV_GS. Measures how effectively gate voltage controls drain current. Key parameter in MOSFET amplifier design.

Q30.

In an intrinsic semiconductor, np product =

  • A n² alone, with little relation to the hole concentration
  • B ni² where ni is intrinsic carrier concentration
  • C n+p, the simple sum of electron and hole concentrations
  • D Zero, as if electrons and holes rarely coexisted in the lattice
Show answer & explanation

Answer: B. ni² where ni is intrinsic carrier concentration

Why: Mass action law: n × p = ni². This holds for both intrinsic and extrinsic semiconductors in thermal equilibrium.

Q31.

LED efficiency (quantum efficiency) is limited by:

  • A The doping concentration alone, with all other factors fixed in many documented cases
  • B Non-radiative recombination, optical extraction losses, and interface defects
  • C The applied forward voltage alone, independent of material quality according to conventional understanding
  • D The temperature coefficient of resistivity of the semiconductor in routine practice
Show answer & explanation

Answer: B. Non-radiative recombination, optical extraction losses, and interface defects

Why: LED efficiency: quantum efficiency limited by non-radiative recombination (Auger, defect), light extraction (total internal reflection), series resistance.

Q32.

Ohmic contact between metal and semiconductor requires:

  • A A lightly doped semiconductor region at the metal interface
  • B Formation of a rectifying Schottky barrier at the junction
  • C Heavily doped semiconductor (tunneling through thin barrier)
  • D An intrinsic, undoped semiconductor region at the contact
Show answer & explanation

Answer: C. Heavily doped semiconductor (tunneling through thin barrier)

Why: Ohmic contact: formed on heavily doped semiconductor. Thin barrier allows tunneling. Resistance independent of current direction.

Q33.

The CMOS inverter uses:

  • A Mainly NMOS transistors arranged in a push-pull configuration
  • B Both NMOS and PMOS transistors complementarily
  • C Mainly PMOS transistors arranged in a push-pull configuration
  • D Bipolar junction transistors instead of field-effect transistors
Show answer & explanation

Answer: B. Both NMOS and PMOS transistors complementarily

Why: CMOS (Complementary MOS): NMOS and PMOS in series. When input HIGH: NMOS on, PMOS off, output LOW. Extremely low static power consumption.

Q34.

Fermi level in n-type semiconductor shifts:

  • A Toward valence band
  • B Toward conduction band
  • C Does not shift
  • D To mid-gap exactly
Show answer & explanation

Answer: B. Toward conduction band

Why: N-type doping: extra electrons push Fermi level toward conduction band. P-type: Fermi level moves toward valence band.

Q35.

The built-in potential (contact potential) across a p-n junction:

  • A Can be measured with voltmeter directly overall
  • B Cannot be utilized as a battery (thermal equilibrium)
  • C Decreases with doping in most cases under typical conditions
  • D Is zero at room temperature according to standard textbooks
Show answer & explanation

Answer: B. Cannot be utilized as a battery (thermal equilibrium)

Why: Built-in potential (0.6-0.7V for Si): thermodynamic equilibrium quantity. Cannot be used as voltage source; no net current in equilibrium.

Q36.

Photovoltaic effect in solar cells converts:

  • A Heat energy directly into electrical energy, in the manner of a thermocouple junction
  • B Light to electricity (photons creating electron-hole pairs separated by p-n junction field)
  • C Electrical energy back into emitted light, in the manner of a forward-biased LED
  • D Stored chemical energy directly into electrical energy, in the manner of a battery
Show answer & explanation

Answer: B. Light to electricity (photons creating electron-hole pairs separated by p-n junction field)

Why: Photovoltaic: photons absorbed create electron-hole pairs. Junction built-in field separates carriers. Electrons go to n-side, holes to p-side creating current.

Q37.

Bipolar transistor current gain beta = hFE represents:

  • A I<sub>B</sub>/I<sub>C</sub>, the reciprocal of the actual current gain ratio
  • B I<sub>C</sub>/I<sub>B</sub> (collector current divided by base current)
  • C I<sub>E</sub>/I<sub>C</sub>, the ratio of emitter current to collector current
  • D V<sub>CE</sub>/V<sub>BE</sub>, a ratio of voltages rather than currents
Show answer & explanation

Answer: B. I<sub>C</sub>/I<sub>B</sub> (collector current divided by base current)

Why: Beta = hFE = I<sub>C</sub>/I<sub>B</sub>. Common emitter current gain. Typical values: 50-300 for BJTs. Small base current controls large collector current.

Q38.

Drift current in semiconductor is caused by:

  • A Concentration gradient
  • B Applied electric field
  • C Temperature gradient
  • D Magnetic field only
Show answer & explanation

Answer: B. Applied electric field

Why: Drift current: carriers move due to electric field. J = sigma × E. Diffusion current: carriers move due to concentration gradient.

Q39.

The I-V equation of a p-n junction diode (Shockley equation):

  • A I = I₀(e<sup>V/VT</sup> - 1)
  • B I = V/R
  • C I = I₀ V
  • D I = I₀ e<sup>-V</sup>
Show answer & explanation

Answer: A. I = I₀(e<sup>V/VT</sup> - 1)

Why: Shockley diode equation: I = I₀(e<sup>V/V<sub>T</sub></sup> - 1) where I₀ = saturation current, V<sub>T</sub> = kT/e ≈ 26 mV at room temperature.

Q40.

In which region does MOSFET act as a voltage-controlled resistor?

  • A Saturation region in general practice
  • B Subthreshold region as frequently described
  • C Triode (linear/ohmic) region
  • D Breakdown region in most textbook accounts
Show answer & explanation

Answer: C. Triode (linear/ohmic) region

Why: Triode (linear) region: V<sub>DS</sub> < V<sub>GS</sub> - V<sub>th</sub>. Channel resistance controlled by V<sub>GS</sub>. MOSFET acts as voltage-controlled resistor.

Hard - 28 questions

Q41.

The Einstein relation between mobility and diffusion coefficient is:

  • A D = mu × kT/e
  • B D = mu × e/kT
  • C D = mu × kT
  • D D/mu = e
Show answer & explanation

Answer: A. D = mu × kT/e

Why: Einstein relation: D/mu = kT/q = V<sub>T</sub> (thermal voltage). Fundamental relationship valid in equilibrium.

Q42.

In an npn BJT in active region: I<sub>E</sub> = I<sub>C</sub> + I<sub>B</sub>. The emitter injection efficiency gamma is:

  • A I<sub>Cn</sub>/I<sub>E</sub>
  • B I<sub>Cp</sub>/I<sub>E</sub>
  • C I<sub>E</sub>/I<sub>C</sub>
  • D I<sub>B</sub>/I<sub>C</sub>
Show answer & explanation

Answer: A. I<sub>Cn</sub>/I<sub>E</sub>

Why: Emitter injection efficiency gamma = fraction of emitter current that is due to minority carriers injected into base. gamma = I<sub>En</sub>/I<sub>E</sub> for npn.

Q43.

Shockley-Read-Hall (SRH) recombination occurs via:

  • A Direct band-to-band recombination
  • B Trap levels in mid-gap
  • C Auger process
  • D Phonon emission only
Show answer & explanation

Answer: B. Trap levels in mid-gap

Why: SRH recombination: trap-assisted. Carrier captured by mid-gap trap, then recombines. Dominant in indirect-gap semiconductors like Si.

Q44.

The channel pinch-off in JFET/MOSFET occurs when:

  • A V<sub>GS</sub> = 0, with the gate-source voltage held at exactly zero
  • B V<sub>DS</sub> = V<sub>GS</sub> - V<sub>p</sub> (or V<sub>GS</sub> - Vth)
  • C I<sub>D</sub> = 0, as if the drain current vanished largely at pinch-off
  • D V<sub>GS</sub> > 0, a condition with little relation to the actual pinch-off point
Show answer & explanation

Answer: B. V<sub>DS</sub> = V<sub>GS</sub> - V<sub>p</sub> (or V<sub>GS</sub> - Vth)

Why: Pinch-off: depletion region extends across channel. V<sub>DS</sub>,sat = V<sub>GS</sub> - Vth. Above V<sub>DS</sub>,sat: I<sub>D</sub> saturates (nearly constant).

Q45.

Quantum confinement in semiconductor nanostructures (quantum dots) causes:

  • A A continuous, bulk-like band structure with little discrete levels
  • B Discrete energy levels and size-tunable bandgap
  • C Metallic, conductor-like behavior with little bandgap
  • D A bandgap that shrinks to exactly zero regardless of dot size
Show answer & explanation

Answer: B. Discrete energy levels and size-tunable bandgap

Why: Quantum confinement: when size < de Broglie wavelength, energy levels become discrete. Bandgap increases as size decreases. Used in tunable LEDs.

Q46.

The NMOS long-channel drain current in saturation (I<sub>D</sub>,sat) ∝

  • A (V<sub>GS</sub> - Vth)
  • B (V<sub>GS</sub> - Vth)²
  • C (V<sub>GS</sub> - Vth)<sup>0.5</sup>
  • D V<sub>DS</sub>
Show answer & explanation

Answer: B. (V<sub>GS</sub> - Vth)²

Why: Long-channel MOSFET saturation: I<sub>D</sub> = (1/2) mu C<sub>ox</sub> (W/L) (V<sub>GS</sub> - Vth)². Quadratic dependence on overdrive voltage.

Q47.

Generation-recombination current in reverse-biased diode scales as:

  • A exp(-E<sub>g</sub>/kT), the simple intrinsic-carrier exponential with little factor of two
  • B exp(-E<sub>g</sub>/2kT) (via mid-gap traps)
  • C ni² × exp(V/2VT), an expression with an incorrect forward-bias-like voltage term
  • D 1/T, a simple inverse-temperature dependence with little exponential
Show answer & explanation

Answer: B. exp(-E<sub>g</sub>/2kT) (via mid-gap traps)

Why: G-R current ~ ni (not ni²), scales as exp(-Eg/2kT). Dominant reverse current in wide-bandgap semiconductors at low temperature.

Q48.

In a CMOS circuit, the power consumption P<sub>dynamic</sub> =

  • A I × V, the basic instantaneous power formula with no switching-frequency term
  • B C × V² × f (capacitance × supply voltage squared × frequency)
  • C V²/R, the static power dissipation formula for a simple resistor
  • D I² × R, the static power dissipation formula in terms of current
Show answer & explanation

Answer: B. C × V² × f (capacitance × supply voltage squared × frequency)

Why: CMOS dynamic power: P = alpha × C<sub>L</sub> × V<sub>DD</sub>² × f. Charging/discharging load capacitance each switching event. Key driver of CPU power limits.

Q49.

The heterojunction (type I): electrons tend to accumulate in:

  • A Wider bandgap material, which has a higher conduction band minimum
  • B Narrower bandgap material (lower conduction band minimum)
  • C Whichever side happens to be doped p-type, regardless of bandgap
  • D Whichever side happens to be doped n-type, regardless of bandgap
Show answer & explanation

Answer: B. Narrower bandgap material (lower conduction band minimum)

Why: Type-I heterojunction (straddled gap): both conduction and valence band offsets confine carriers to narrower bandgap material. Used in quantum well lasers.

Q50.

Negative differential resistance (NDR) is observed in:

  • A Standard ohmic resistors, where resistance never decreases with current
  • B Tunnel diodes (Esaki diodes) at forward bias
  • C Ideal p-n junction diodes under normal forward or reverse bias
  • D Ordinary Schottky diodes used for fast rectification
Show answer & explanation

Answer: B. Tunnel diodes (Esaki diodes) at forward bias

Why: Tunnel diode: at certain forward bias, tunneling current decreases as bias increases (NDR region). Used in oscillators and fast switches.

Q51.

The Zener diode breakdown voltage temperature coefficient is:

  • A Always positive, regardless of the underlying breakdown mechanism
  • B Negative for Zener (<5V), positive for avalanche (>7V)
  • C Exactly zero, with the breakdown voltage independent of temperature
  • D Independent of mechanism, with Zener and avalanche behaving identically
Show answer & explanation

Answer: B. Negative for Zener (<5V), positive for avalanche (>7V)

Why: Zener (<5-6V): tunneling, negative TC. Avalanche (>7V): ionization, positive TC. At ~5.6V: compensate for near-zero TC in reference diodes.

Q52.

The depletion approximation in p-n junction analysis assumes:

  • A A gradual, smoothly varying doping profile across the junction
  • B Complete ionization within depletion region and zero carriers (sharp boundary)
  • C A significant population of mobile carriers within the depletion region
  • D An intrinsic, undoped semiconductor on both sides of the junction
Show answer & explanation

Answer: B. Complete ionization within depletion region and zero carriers (sharp boundary)

Why: Depletion approximation: ionized donors/acceptors present in depletion region; mobile carrier density negligible. Creates abrupt space charge regions.

Q53.

Phonon dispersion in semiconductor: acoustic vs optical modes differ because:

  • A Acoustic modes involve same-sub-lattice atoms moving in phase; optical involve opposite sublattice atoms out of phase
  • B Acoustic modes actually exhibit a higher vibrational frequency throughout the Brillouin zone than optical modes do
  • C Optical phonon modes are actually what carry ordinary sound waves through the crystal lattice
  • D Acoustic and optical phonon modes are physically identical in dispersion and frequency in every respect
Show answer & explanation

Answer: A. Acoustic modes involve same-sub-lattice atoms moving in phase; optical involve opposite sublattice atoms out of phase

Why: Acoustic: atoms in same unit cell move in phase (sound waves). Optical: atoms in different sub-lattices move out of phase (interacts with IR light). Key for understanding thermal conductivity and electron scattering.

Q54.

The charge control model of BJT describes:

  • A Mainly the static DC bias point, with little transient information
  • B Transient response via stored charge in base (Q<sub>B</sub> = I<sub>C</sub> × tau_F)
  • C Mainly the large-signal switching behavior, ignoring small-signal response
  • D Random thermal and shot noise generated within the transistor
Show answer & explanation

Answer: B. Transient response via stored charge in base (Q<sub>B</sub> = I<sub>C</sub> × tau_F)

Why: Charge control model: I<sub>C</sub> = Q<sub>B</sub>/tau_F where Q<sub>B</sub> is minority charge stored in base and tau_F is forward transit time. Foundation of BJT switching analysis.

Q55.

Channel length modulation in MOSFET causes:

  • A A shift in the threshold voltage of the transistor itself
  • B Non-zero output conductance (dI_D/dV_DS) in saturation
  • C Complete pinch-off of the channel with zero drain current
  • D Leakage current flowing directly through the gate oxide
Show answer & explanation

Answer: B. Non-zero output conductance (dI_D/dV_DS) in saturation

Why: Channel length modulation (lambda parameter): effective channel shortens as V<sub>DS</sub> increases. I<sub>D</sub>,sat = (1/2)mu C<sub>ox</sub>(W/L)(V<sub>GS</sub>-Vth)²(1+lambda V<sub>DS</sub>). Finite output resistance.

Q56.

In a 2DEG (2D electron gas) at heterojunction, mobility is very high because:

  • A A higher concentration of dopant atoms is introduced near the channel
  • B Electrons spatially separated from ionized dopants, reducing Coulomb scattering
  • C The device is simply operated at a lower temperature with no spatial effect
  • D A thicker semiconductor layer is used in the heterostructure
Show answer & explanation

Answer: B. Electrons spatially separated from ionized dopants, reducing Coulomb scattering

Why: 2DEG in HEMT: ionized donors in wide-gap layer, electrons accumulate in narrow-gap layer. Spatial separation reduces impurity scattering. Ultra-high mobility.

Q57.

The Gunn effect in GaAs: electrons in high electric field undergo:

  • A Simple velocity saturation, as seen in ordinary silicon at high fields according to most researchers
  • B Intervalley transfer from gamma valley (high mobility) to L valley (low mobility), causing NDR
  • C Impact ionization generating additional electron-hole pairs in the majority of cases studied
  • D Direct recombination of the conduction electrons with holes as widely reported in standard practice
Show answer & explanation

Answer: B. Intervalley transfer from gamma valley (high mobility) to L valley (low mobility), causing NDR

Why: Gunn effect: high field transfers electrons from high-mobility central valley to low-mobility satellite valleys. Average velocity decreases. NDR → oscillations.

Q58.

Lightly doped drain (LDD) structure in short-channel MOSFETs is designed to:

  • A Increase the overall drive current delivered by the transistor under most conditions encountered
  • B Reduce hot carrier effects and drain-induced barrier lowering at drain edge
  • C Increase the threshold voltage required to turn on the device as frequently observed in practice
  • D Decrease the gate-to-channel capacitance of the transistor in many documented cases
Show answer & explanation

Answer: B. Reduce hot carrier effects and drain-induced barrier lowering at drain edge

Why: LDD: graded doping near drain reduces peak electric field. Mitigates hot carrier injection into gate oxide, improving long-term reliability.

Q59.

The diffusion length of minority carriers L = sqrt(D × tau). In short devices (L<sub>device</sub> << L):

  • A Most carriers recombine before reaching junction according to conventional understanding
  • B Most carriers reach the junction (low recombination loss)
  • C Diffusion is negligible in routine practice overall
  • D Drift dominates usually in most cases under typical conditions
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Answer: B. Most carriers reach the junction (low recombination loss)

Why: If device length much shorter than diffusion length, minority carriers traverse the base/region with minimal recombination. High efficiency (solar cells, BJT base).

Q60.

Threshold voltage roll-off in short-channel MOSFETs occurs because:

  • A The gate oxide layer becomes progressively thicker as the channel length is shortened according to standard textbooks
  • B Drain depletion charge extends under channel, reducing effective Vth (drain-induced barrier lowering, DIBL)
  • C The gate dielectric layer undergoes a sudden catastrophic electrical breakdown event in general practice
  • D The substrate doping concentration increases sharply near the shortened channel region as frequently described
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Answer: B. Drain depletion charge extends under channel, reducing effective Vth (drain-induced barrier lowering, DIBL)

Why: Short channel effects: drain depletion region reduces barrier for channel formation. Vth decreases as channel length shrinks. DIBL causes V<sub>th</sub> to decrease with V<sub>DS</sub>.

Q61.

When an intrinsic semiconductor is doped with a pentavalent impurity, it becomes:

  • A n-type
  • B p-type
  • C an insulator
  • D a superconductor
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Answer: A. n-type

Why: Pentavalent donors add free electrons, producing an n-type semiconductor.

Q62.

A p-n junction diode under forward bias:

  • A conducts with low resistance
  • B blocks current completely
  • C has very high resistance
  • D acts as a perfect insulator
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Answer: A. conducts with low resistance

Why: Forward bias lowers the barrier so the diode conducts with low resistance.

Q63.

A Zener diode is normally used as a:

  • A voltage regulator (in reverse breakdown)
  • B signal amplifier
  • C oscillator
  • D half-wave rectifier only
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Answer: A. voltage regulator (in reverse breakdown)

Why: Operated in reverse breakdown, the Zener diode maintains a nearly constant voltage, acting as a regulator.

Q64.

A full-wave rectifier fed with a 50 Hz AC supply produces a ripple in the output at a frequency of:

  • A 25 Hz
  • B 50 Hz
  • C 100 Hz
  • D 200 Hz
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Answer: C. 100 Hz

Why: A full-wave rectifier produces two output pulses per input cycle, so the ripple frequency is 2·50 = 100 Hz.

Q65.

Which logic gate is called a universal gate?

  • A NAND gate
  • B OR gate
  • C NOT gate
  • D AND gate
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Answer: A. NAND gate

Why: The NAND gate (like NOR) can be combined to make any other logic gate, so it is universal.

Q66.

In a common-emitter transistor amplifier, the phase difference between the input and output voltages is:

  • A
  • B 90°
  • C 180°
  • D 360°
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Answer: C. 180°

Why: A common-emitter amplifier inverts the signal, giving a 180° phase difference.

Q67.

The approximate energy band gap of silicon at room temperature is:

  • A 0 eV
  • B 0.01 eV
  • C 1.1 eV
  • D 6 eV
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Answer: C. 1.1 eV

Why: Silicon has a band gap of about 1.1 eV, typical of a semiconductor.

Q68.

For a two-input AND gate, the output when the inputs are 1 and 0 is:

  • A 0
  • B 1
  • C undefined
  • D oscillating
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Answer: A. 0

Why: An AND gate outputs 1 only when all inputs are 1; with inputs 1 and 0 the output is 0.